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TC3400
+1.8V, Low Power, 16-Bit Sigma-Delta A/D Converter
Features
* 16-bit Resolution at Eight Conversions Per Second, Adjustable Down to 10-bit Resolution at 512 Conversions Per Second * 1.8V - 5.5V Operation, Low Power Operating 260A; Sleep: 0.75A * microPortTM Serial Bus Requires only two Interface Lines * Uses Internal or External Reference * Automatically Enters Sleep Mode when not in use
Package Type
8-Pin SOIC
IN+ INREFIN GND 1 2 3 4 8 VDD
TC3400
7 6 5
SCLK SDAT REFOUT
Applications
* Consumer Electronics, Thermostats, CO Monitors, Humidity Meters, Security Sensors * Embedded Systems, Data Loggers, Portable Equipment * Medical Instruments
IN+ INREFIN GND 1 2 3 4
8-Pin PDIP
8 VDD
TC3400
7 6 5
SCLK SDAT REFOUT
Device Selection Table
Part Number TC3400VPA TC3400VOA Package 8-Pin PDIP (Narrow) 8-Pin SOIC (Narrow) Temperature Range 0C to +85C 0C to +85C
General Description
The TC3400 is a low cost, low power analog-to-digital converter based on Microchip's Sigma-Delta technology. It will perform 16-bit conversions (15-bit plus sign) at up to eight per second. The TC3400 is optimized for use as a microcontroller peripheral in low cost, battery operated systems. A voltage reference is included, or an external reference can be used. The TC3400's 2-wire microPortTM digital interface is used for starting conversions and for reading out the data. Driving the SCLK line low starts a conversion. After the conversion starts, each additional falling edge (up to six) detected on SCLK for t4 seconds reduces the A/D resolution by one bit and cuts conversion time in half. After a conversion is completed, clocking the SCLK line puts the MSB through LSB of the resulting data word onto the SDAT line, much like a shift register. The part automatically sleeps when not performing a data conversion. The TC3400 is available in a 8-Pin PDIP and a 8-Pin SOIC package.
2002 Microchip Technology Inc.
DS21409B-page 1
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TC3400
Typical Application
VBATT
+
V IN1+ IN1-
DD
VCC SDAT SCLK I/01 I/02 Controller
TC3400
REFIN REFOUT C1 0.1F R3 390
Functional Block Diagram
VDD REFOUT
TC3400
1.193V x2
REFIN
IN+ IN-
+ - CONV Done
S-D Modulator
Data Shift Reg.
SDAT
CONVCLK
Clock Generator and Control Circuitry
CLKOUT
SCLK
GND
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DS21409B-page 2
2002 Microchip Technology Inc.
TC3400
1.0 ELECTRICAL CHARACTERISTICS
*Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.
Absolute Maximum Ratings*
Supply Voltage ..................................................... 6.0V Input Voltage (All Other Pins): ............................... (GND - 0.3V) to (VDD + 0.3V) Operating Temperature Range ................. 0C to 85C Storage Temperature ........................ -65C to +150C
TC3400 DC ELECTRICAL SPECIFICATIONS
Electrical Characteristics: TA = 25C and VDD = 2.7V, unless otherwise specified. Boldface type specifications apply for temperatures of 0C to 85C. VREF = 1.25V, Internal Clock Frequency = 520kHz. Symbol Power Supply VDD IDD IDDSLEEP Supply Voltage Supply Current, During Data Conversion Supply Current, Sleep Mode 1.8 -- -- -- Accuracy (Differential Inputs) RES INL VOS VNOISE CMR FSE PSRR IN+, INVIN Differential Input Voltage Absolute Voltage Range on IN+, INInput Bias Current CIN RIN Input Sampling Capacitance Differential Input Resistance -- -- -- -- -- -- -- 1 2 2.0 2.5 VDD 100 -- -- V V nA pF M Note 2 Note 1 Resolution Integral Non-Linearity Offset Error Referred to input Common Mode Rejection Full Scale Error Power Supply Rejection Ratio -- -- -- -- -- -- -- 16 .0038 -- 60 75 0.4% 75 -- -- 0.9 -- -- -- -- Bits %FSR %FSR VDD = 2.7V IN+, IN- = 0V At DC VDD = 2.5V to 3.5V -- 260 0.75 1.2 5.5 -- 1.5 3.0 V Parameter Min Typ Max Unit Test Conditions
A A A
TA = +25C
Vrms
dB %FS dB
REFIN, REFOUT VREF IREF VREFOUT REFSINK REFSRC REFIN Voltage Range REFIN Input Current REFOUT Voltage REFOUT Current Sink Capability REFOUT Current Source Capability 0 -- -- -- 300 -- 1 1.193 10 -- 1.25 -- -- -- -- V A V A
A
Note 1: Differential input voltage defined as (VIN+ - VIN -). 2: Resistance from INn+ to INn- or INn to GND. 3: @ VDD = 1.8V, ISOURCE 200A.
2002 Microchip Technology Inc.
DS21409B-page 3
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TC3400
TC3400 DC ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: TA = 25C and VDD = 2.7V, unless otherwise specified. Boldface type specifications apply for temperatures of 0C to 85C. VREF = 1.25V, Internal Clock Frequency = 520kHz. Symbol SCLK VIL VIH ILEAK SDAT VOL VOH Output Low Voltage Output High Voltage (SDAT) -- 0.9 x VDD -- -- 0.4 -- V V IOL = 1.5mA ISOURCE = 400A (Note 3) Input Low Voltage Input High Voltage Leakage Current -- 0.7 x VDD -- -- -- 1 0.3 x VDD -- -- V V Parameter Min Typ Max Unit Test Conditions
A
Note 1: Differential input voltage defined as (VIN+ - VIN -). 2: Resistance from INn+ to INn- or INn to GND. 3: @ VDD = 1.8V, ISOURCE 200A.
TC3400 AC ELECTRICAL SPECIFICATIONS
Electrical Characteristics: TA = 25C and VDD = 2.7V, unless otherwise specified. Boldface type specifications apply for temperatures of 0C to 85C. VREF = 1.25V, Internal Clock Frequency = 520kHz. Symbol t1 t2 t3 Parameter Resolution Reduction Clock Width Resolution Reduction Clock Width Conversion Time (15-bit Plus Sign) Conversion Time (14-bit Plus Sign) Conversion Time (13-bit Plus Sign) Conversion Time (12-bit Plus Sign) Conversion Time (11-bit Plus Sign) Conversion Time (10-bit Plus Sign) Conversion Time (9-bit Plus Sign) t4 t5 t8 Resolution Reduction Window SCLK to Data Valid Acknowledge Delay Min 1 1 -- -- -- -- -- -- -- -- 1000 -- Typ -- -- 125 t3/2.0 t3/4.0 t3/7.8 t3/15.1 t3/28.6 t3/51.4 t3/85.7 -- -- Max -- -- -- -- -- -- -- -- -- -- -- 1000 Unit sec sec msec msec msec msec msec msec msec msec nsec nsec Test Conditions Width of SCLK (Negative) Width of SCLK (Positive) 16-bit Conversion, TA = 25C (Note 1) 15-bit Conversion 14-bit Conversion 13-bit Conversion 12-bit Conversion 11-bit Conversion 10-bit Conversion Width of SCLK SCLK Falling Edge to SDAT Valid SCLK to SDAT Delay
Note 1: Nominal temperature drift is -2830ppm/C for temperature less than 25C and -1340ppm/C for temperatures greater than 25C.
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DS21409B-page 4
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TC3400
2.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
Pin No. (8-Pin SOIC) (8-Pin PDIP) 1 2 3
PIN FUNCTION TABLE
Symbol IN+ INREFIN Description Analog Input. This is the positive terminal of a true differential input consisting of IN+ and IN-. VIN1 = (IN+ - IN-). See Section 1.0 Electrical Characteristics. Analog Input. This is the negative terminal of a true differential input consisting of IN+ and IN-. VIN = (IN+ - IN-) IN- can swing to, but not below, ground. Analog Input. The converter's reference voltage is the differential between this pin and ground times two. It may be tied directly to REFOUT or scaled using a resistor divider. Any user supplied reference voltage less than 1.25V may be used in place of REFOUT. Ground Terminal. Analog Output. The internal reference connects to this pin. It may be scaled externally, if desired, and tied to the REFIN input to provide the converter's reference voltage. Care must be taken in connecting external circuitry to this pin. Digital Output (push-pull). This is the microPortTM serial data output. SDAT is driven low while the TC3400 is converting data, effectively providing a "busy" signal. After the conversion is complete, every high to low transition on the SCLK pin puts a bit from the resulting data word on the SDAT pin (from MSB to LSB). Digital Input. This is the microPortTM serial clock input. The TC3400 comes out of sleep mode and a conversion cycle begins when this pin is driven low. After the conversion starts, each additional falling edge (up to six) detected on SCLK for t4 seconds reduces the A/D resolution by one bit. When the conversion is complete, the data word can be shifted out on the SDAT pin by clocking the SCLK pin. Power Supply Input.
4 5
GND REFOUT
6
SDAT
7
SCLK
8
VDD
2002 Microchip Technology Inc.
DS21409B-page 5
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TC3400
3.0 DETAILED DESCRIPTION
TABLE 3-1:
The TC3400 is a 16-bit sigma-delta A/D converter with one differential input. See the Typical Application circuit and the Functional Block diagram. The key components of the TC3400 are described below. Also refer to Figure 3-4, A/D Operational Flowchart and the Timing Diagrams, Figure 3-1, Figure 3-2 and Figure 3-3).
DATA CONVERSION WORD VS. VOLTAGE INPUT (REFIN = 1.193V)
INn+ - INn- (Volts) 2.38596 (Positive Full Scale) 72.8 E -6 0 -72.8 E -6 -2.38596 (Negative Full Scale) Reserved Code
Data Word 0111 1111 1111 1111 0000 0000 0000 0001 0000 0000 0000 0000 1111 1111 1111 1111 1000 0000 0000 0001 1000 0000 0000 0000
3.1
A/D Converter Operation
When the TC3400 is not converting, it is in sleep mode with both the SCLK and SDAT lines high. An A/D conversion is initiated by a high to low transition on the SCLK line at which time the internal clock of the TC3400 is started. Each additional high to low transition of SCLK (following the initial SCLK falling edge) during the time interval t4, will decrement the conversion resolution by one bit and reduce the conversion time by one half. The time interval t4 is referred to as the resolution reduction window. The minimum conversion resolution is 10-bits so any more than 6 SCLK transitions during t4 will be ignored. After each high to low transition of SCLK, in the t4 interval, the SDAT output is driven high by the TC3400 to acknowledge that the conversion has been decremented. When the SCLK returns high or the t4 interval ends, the SDAT line returns low (see Figure 3-2). When the conversion is complete SDAT is driven high. The TC3400 now enters sleep mode and the conversion value can be read as a serial data word on the SDAT line.
The SCLK input has a filter which rejects any positive or negative pulse of width less than 50nsec to reduce noise. The rejection width of this pulse can vary between 50nsec and 750nsec depending on processing parameters and supply voltage. Figure 3-1 and Table 3-2 show information for determining the mode of operation for the TC3400 part by recording the value of SDAT for SCLK in a high, then low, then high state. For example, if SCLK goes through a 1-0-1 transition and the corresponding values of SDAT are 1-1-0, then the SCLK falling edge started a new data conversion. A 0-1-0 for SDAT would have indicated a resolution reduction had occurred. This is useful if the microcontroller has a watchdog reset or otherwise loses track of where the TC3400 is in the conversion and data readout sequence. The microcontroller can simply transition SCLK until it "finds" a Start Conversion condition.
FIGURE 3-1:
SCLK
3.2
Reading the Data Word
SCLK, SDAT LOGIC STATE DIAGRAM
After the conversion is complete and SDAT goes high, the conversion value can be clocked serially onto the SDAT line by high to low transitions of the SCLK. The data word is in two's compliment format with the sign bit clocked onto the SDAT line, first followed by the MSB and ending in the LSB. For a 16-bit conversion the data word would consist of a sign bit followed by 15 magnitude bits, Table 3-1 shows the data word versus input voltage for a 16-bit conversion. Note that the full scale input voltage range is (2 REFIN - 1LSB). When REFOUT is fed back directly to REFIN, an LSB is 73V for a 16-bit conversion, as REFOUT is typically 1.193V. Figure 3-3 shows typical SCLK and SDAT waveforms for 16, 12 and 10-bit conversions. Note that any complete convert and read cycle requires 17 negative edge clock pulses. The first is the convert command. Then, up to six of these can occur in the resolution reduction window, t4, to decrement resolution. The remaining pulses clock out the conversion data word.
SDAT
A
B
C
TABLE 3-2:
A 1 0 x x B 1 1 1 0
SCLK, SDAT LOGIC STATE
C 0 0 1 0 Status Start Conversion Resolution Reduction Data Transfer Data Transfer or Busy*
*Note: The code X00 has a dual meaning: Data Transfer or
Busy converting. To avoid confusion, the user should send only the required number of pulses for the desired resolution, then wait for SDAT to rise to 1, indicating conversion is complete before clocking SCLK again to read out data bits.
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DS21409B-page 6
2002 Microchip Technology Inc.
TC3400
FIGURE 3-2:
t2 SCLK t1
CONVERSION AND DATA OUTPUT TIMING
t4 SDAT
t8
t8 DN (MSB)
t5 DN-1 DN-2 D0 (LSB)
Sleep Mode
t3 Data Conversion Complete Start Conversion and Resolution Control Timing
Data Output Timing
FIGURE 3-3:
SCLK AND SDAT WAVEFORMS FOR 16, 12 AND 10-BIT CONVERSIONS
16-bit Data Conversion, Data Word A5A5h
SCLK t3a SDAT Data Conversion Complete 16-bit Data Conversion, Long Start Pulse, Data Word 5A5Ah SCLK > t3a SDAT Data Conversion Complete 12-bit Conversion, Data Word = AB3h SCLK < t4 SDAT Data Conversion Complete 10-bit Conversion with "Extra" Data Reduction Clocks, Data Word = 3A4h SCLK < t4 t3g SDAT Data Conversion Complete
t3e
2002 Microchip Technology Inc.
DS21409B-page 7
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TC3400
FIGURE 3-4: A/D OPERATIONAL FLOWCHART
SDAT = Low POR
CONVCLK = 2m? (Conversion Done?) Sleep SDAT = High Yes
No
No
SCLK Hgh to Low? Yes
Power Down Analog, Conversion Complete, SDAT = High
Power Up Analog, Start CONVCLK (= 0), Start Conversion, Resolution = 2m (m = 16), Latch Input Channel Address (if applicable).
SCLK High to Low? Yes
No
SCLK Low to High transition? Yes SDAT = Low
No SDAT = Dm; m=m-1
m 0? No No
Yes
CONVCLK < 29? Yes
SDAT = High Internal Reset
No
SCLK High to Low? Sleep Yes
No
A/D Resolution > 210? Yes Reduce A/D Resolution by 1-bit (m = m - 1); SDAT = High
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DS21409B-page 8
2002 Microchip Technology Inc.
TC3400
4.0
4.1
PACKAGING INFORMATION
Package Marking Information
Package marking data not available at this time.
4.2
Taping Forms
Component Taping Orientation for 8-Pin SOIC (Narrow) Devices
User Direction of Feed
PIN 1
W
P Standard Reel Component Orientation for TR Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size
8-Pin SOIC (N)
12 mm
8 mm
2500
13 in
2002 Microchip Technology Inc.
DS21409B-page 9
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TC3400
4.3 Package Dimensions
8-Pin Plastic DIP
PIN 1
.260 (6.60) .240 (6.10)
.045 (1.14) .030 (0.76) .400 (10.16) .348 (8.84) .200 (5.08) .140 (3.56) .150 (3.81) .115 (2.92)
.070 (1.78) .040 (1.02)
.310 (7.87) .290 (7.37)
.040 (1.02) .020 (0.51)
.015 (0.38) .008 (0.20) .400 (10.16) .310 (7.87)
3 MIN.
.110 (2.79) .090 (2.29)
.022 (0.56) .015 (0.38)
Dimensions: inches (mm)
8-Pin SOIC
PIN 1
.157 (3.99) .150 (3.81)
.244 (6.20) .228 (5.79)
.050 (1.27) TYP.
.197 (5.00) .189 (4.80) .069 (1.75) .053 (1.35) .020 (0.51) .010 (0.25) .013 (0.33) .004 (0.10) .010 (0.25) .007 (0.18) .050 (1.27) .016 (0.40) Dimensions: inches (mm)
8 MAX.
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DS21409B-page 10
2002 Microchip Technology Inc.
TC3400
NOTES:
2002 Microchip Technology Inc.
DS21409B-page 11
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TC3400
NOTES:
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DS21409B-page 12
2002 Microchip Technology Inc.
TC3400
SALES AND SUPPORT
Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
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DS21409B-page 13
TC3400
NOTES:
DS21409B-page 14
(c) 2002 Microchip Technology Inc.
TC3400
Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights.
Trademarks The Microchip name and logo, the Microchip logo, FilterLab, KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER, PICSTART, PRO MATE, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, MXDEV, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2002, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company's quality system processes and procedures are QS-9000 compliant for its PICmicro (R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001 certified.
2002 Microchip Technology Inc.
DS21409B-page 15
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05/01/02
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DS21409B-page 16
2002 Microchip Technology Inc.
*B90412SD*

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